Componentes electrónicos : HY27LF081G2M-TES

Fabricante : Hynix Semiconductor

Embalaje :

Pins :

Descripción :

Temperatura : Min °C | Máx °C

Datasheet : HY27LF081G2M-TES PDF

• HY27LF081G2M-TCB
• HY27LF081G2M-TCP
• HY27LF081G2M-TCS
• HY27LF081G2M-TEB
• HY27LF081G2M-TEP
• HY27LF081G2M-TES
• HY27LF081G2M-TIB
• HY27LF081G2M-TIP
• HY27LF081G2M-TIS
• HY27LF081G2M-TMB
• HY27LF081G2M-TMP
• HY27LF081G2M-TMS
• HY27LF081G2M-TPCB
• HY27LF081G2M-TPCP
• HY27LF081G2M-TPCS