Componentes electrónicos : MR18R326GAG0

Fabricante : SAMSUNG[Samsung semiconductor]

Embalaje :

Pins :

Descripción : (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

Temperatura : Min °C | Máx °C

Datasheet : MR18R326GAG0 PDF

• MR18R326GAG0
• MR18R326GAG0-CM8
• MR18R326GAG0-CT9